Cutting / Sawing
The slicing and dicing of our proprietary CdZnTe crystals is the first step in converting the raw crystal ingots into radiation detectors of various configurations. In our state-of-the-art precision wire-saw and dicing facility we ensure that tight dimensional tolerances and quality are maintained. Characterization of the ingots prior to slicing ensures the finished detectors meet performance requirements and customer specifications.
Product Assembly
In our flexible, state-of-the-art product assembly area, CdZnTe detector assemblies are mounted and then integrated into final electronic and mechanical designs. These final detector assemblies are then rigorously
tested to ensure they meet rigid quality and performance requirements.
Lean manufacturing philosophies such as flexible work cells, multi-skilled personnel and real time inventory, are employed to provide responsive and flexible manufacturing capabilities. The 10,000 square feet (1,000 square meter) assembly area provides both the capacity and the flexibility to produce products ranging from single channel radiation detectors to sophisticated multi-channel imaging systems with complete readout electronics, mechanical systems, and communication protocols.
These capabilities enable EI Detection & Imaging Systems to design and manufacture the highest performance CdZnTe radiation detector systems and subassemblies available.
| Low to medium volume, high-mix capable facility |
| Flexible work cells and multi-skilled personnel |
| Dedicated in-house detector bonding line |
| Thin film, thick film, chip & wire, and surface mount electronics |
| Multi-channel, analog and mixed signal ASIC’s |
| Rapid prototyping and customization capabilities |
| Complete engineering design services |
Surface Processing
Our precision mechanical and chemical polishing processes are utilized to prepare our detectors for electrode deposition. Complex preparation and detailed quality control methods are employed to ensure product uniformity across the wide range of specifications and detector configurations that we support.
Photolithography
In our class 1000 clean room facility, using semiconductor processing techniques, we image and deposit the electrodes and pixilated patterns necessary for the wide range of radiation detection and imaging applications we support. This process includes thin film metallization, reactive ion sputtering for passivation, and custom designed lithographic patterning.
